IC Onlineerai

Hua Hai Qing Ke Launches Beijing Facility to Advance Semiconductor Equipment Development

On January 15, Hua Hai Qing Ke officially launched its Beijing facility, marking a significant milestone for the company’s Integrated Circuit High-End Equipment R&D and Industrialization Project. This new facility is managed by Hua Hai Qing Ke (Beijing) Technology Co., Ltd., a wholly-owned subsidiary of the company.

On January 15, Hua Hai Qing Ke officially launched its Beijing facility, marking a significant milestone for the company’s Integrated Circuit High-End Equipment R&D and Industrialization Project. This new facility is managed by Hua Hai Qing Ke (Beijing) Technology Co., Ltd., a wholly-owned subsidiary of the company.

Located in Yizhuang New City, Beijing, the facility spans over 70,000 square meters and is dedicated to the development and industrialization of advanced semiconductor equipment. With its inauguration, Hua Hai Qing Ke aims to accelerate innovation in wet etching, wafer thinning, and chemical mechanical polishing (CMP) technologies. The facility will also enhance the company's production capacity and strengthen its research and development capabilities.

Company Overview

Hua Hai Qing Ke is a leading high-end semiconductor equipment manufacturer with core independent intellectual property rights. The company offers a broad range of products and services, including:

CMP equipment for polishing semiconductor wafers.

Thinning equipment to enable the production of ultra-thin wafers.

Dicing equipment for wafer cutting.

Wet process equipment for cleaning and etching.

Wafer regeneration services to recycle used wafers.

Consumables and maintenance services to support semiconductor manufacturers.

By integrating advanced equipment manufacturing with support services, Hua Hai Qing Ke provides comprehensive solutions for the semiconductor industry.

The launch of the Beijing facility signals Hua Hai Qing Ke’s commitment to advancing domestic semiconductor capabilities and driving innovation in China’s semiconductor equipment sector.

Related Articles

  • Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in CaliforniaNews

    Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in California

    May 8, 2025 – California, USA — Cisco Systems has taken a bold step into the future of computing by unveiling a prototype quantum networking chip designed to interconnect quantum computers. At the same time, the company announced the establishment of a brand-new quantum computing research lab in Santa Monica, California, marking a major expansion into the quantum technology landscape.

  • Qualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance BoostNews

    Qualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance Boost

    Qualcomm is expected to unveil its next-generation flagship mobile chipset — the Snapdragon 8 Elite Gen 2 — during its Snapdragon Tech Summit, which has been rescheduled earlier this year for September 2025. Ahead of the official launch, key details about the chipset’s architecture and performance enhancements have surfaced, setting the stage for a major leap in mobile computing power.

  • NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10xNews

    NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10x

    May 9, 2025 — U.S.-based memory innovator NEO Semiconductor has announced a major leap in dynamic random-access memory (DRAM) architecture with the launch of its new-generation 3D X-DRAM technology, featuring the industry’s first 1T1C and 3T0C 3D DRAM cell designs. This breakthrough is set to redefine memory performance and scalability for high-demand applications in AI, edge computing, and in-memory processing.

  • GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15News

    GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15

    May 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.

  • EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal DoubtsNews

    EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts

    The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.