IC Onlineerai

Japan to Launch 10 Trillion Yen Plan to Support Chip and AI Development

On November 11, Japanese Prime Minister Shigeru Ishiba announced a plan for the Japanese government to provide at least 10 trillion yen (approximately $65 billion) by fiscal year 2030 to support the semiconductor and artificial intelligence industries.

On November 11, Japanese Prime Minister Shigeru Ishiba announced a plan for the Japanese government to provide at least 10 trillion yen (approximately $65 billion) by fiscal year 2030 to support the semiconductor and artificial intelligence industries.

In a press conference, Ishiba stated that a new assistance framework has been established to attract more than 50 trillion yen in public and private investment over the next decade, which will be incorporated into the comprehensive economic plan finalized in November. One of the beneficiaries will be Rapidus, a state-supported initiative for mass-producing advanced chips.

The assistance will take the form of subsidies, investments by government-affiliated institutions, and debt guarantees for loans provided by private financial groups. Ishiba emphasized that Japan will not issue deficit government bonds to fund this plan.

https://ic-online.com/contacts

The Japanese government will introduce a framework to strengthen the AI and semiconductor industry foundation, with a vision extending to fiscal year 2030. It is expected to bring an overall economic impact of 160 trillion yen. According to a report by Nikkei, relevant departments and institutions are preparing legislation to provide debt guarantees and investments for Rapidus, with the goal of submitting a proposal to the National Diet by 2025.

The Japanese government believes that establishing advanced semiconductors is essential for economic security. Due to the low predictability of single-year, single-payment subsidies, the government has adjusted its approach to provide multi-year assistance.

Rapidus is expected to begin mass production of new chips in 2027, with the Japanese government providing comprehensive support. The government has already granted 920 billion yen, and the Rapidus project will need 5 trillion yen to achieve mass production.

Related Articles

  • Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in CaliforniaNews

    Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in California

    May 8, 2025 – California, USA — Cisco Systems has taken a bold step into the future of computing by unveiling a prototype quantum networking chip designed to interconnect quantum computers. At the same time, the company announced the establishment of a brand-new quantum computing research lab in Santa Monica, California, marking a major expansion into the quantum technology landscape.

  • EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal DoubtsNews

    EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts

    The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.

  • TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.News

    TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.

    TSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.

  • Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation CapabilitiesNews

    Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities

    Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.

  • NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10xNews

    NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10x

    May 9, 2025 — U.S.-based memory innovator NEO Semiconductor has announced a major leap in dynamic random-access memory (DRAM) architecture with the launch of its new-generation 3D X-DRAM technology, featuring the industry’s first 1T1C and 3T0C 3D DRAM cell designs. This breakthrough is set to redefine memory performance and scalability for high-demand applications in AI, edge computing, and in-memory processing.