Japanese Semiconductor Leaders Launch New SiC Power Modules for EVs and Home Appliances
Two major Japanese semiconductor companies—ROHM Co., Ltd. and Mitsubishi Electric Corporation—have announced new product lines based on silicon carbide (SiC) technology. These next-generation power modules are designed to serve the growing demands of electric vehicles (EVs) and home appliances, leveraging SiC’s advantages in high voltage resistance, thermal stability, and energy efficiency.
Two major Japanese semiconductor companies—ROHM Co., Ltd. and Mitsubishi Electric Corporation—have announced new product lines based on silicon carbide (SiC) technology. These next-generation power modules are designed to serve the growing demands of electric vehicles (EVs) and home appliances, leveraging SiC’s advantages in high voltage resistance, thermal stability, and energy efficiency.
ROHM Introduces High-Efficiency SiC Module for Electric Vehicles
ROHM has unveiled a new line of SiC-based power semiconductor modules specifically engineered for the EV market. Utilizing a third-generation SiC architecture, the new module achieves up to 50% higher energy efficiency compared to conventional products. This leap in performance contributes to both faster charging speeds and extended driving ranges for electric vehicles.
The module groups four to six SiC power devices into a single unit, optimized for 22kW-class onboard chargers in large battery electric vehicles. ROHM will offer 13 different module types to meet the varying voltage and power requirements of different EV models.
Notably, the design reduces the total installation area by up to 50%, enabling lighter systems, improving power density, and ultimately extending battery life and driving range. The modules are also suited for EV chargers and charging station infrastructure.
Manufacturing will be split across Japan and Thailand, with substrate circuit fabrication handled in Fukuoka and Miyazaki, and final assembly in Thailand. ROHM is targeting a monthly production volume of 100,000 units, with annual sales of 10 billion yen projected.
Mitsubishi Electric Launches SiC-Based SLIMDIP Modules for Household Appliances
On April 22, Mitsubishi Electric introduced two new SLIMDIP series modules: the PSF15SG1G6 (full SiC) and the PSH15SG1G6 (hybrid SiC). These compact power modules are optimized for indoor air conditioners and a wide range of home appliances.
This marks the first integration of SiC technology into Mitsubishi’s SLIMDIP series. The new designs incorporate proprietary SiC MOSFET chips, achieving superior output performance and lower power loss. Compared to traditional silicon-based components, the full SiC module reduces power loss by 79%, while the hybrid model cuts losses by 47%, enabling significant energy savings across both low- and high-capacity appliances.
Mitsubishi Electric has a long-standing presence in the SiC market. Notable milestones include the deployment of SiC modules in air conditioners as early as 2010, commercial release of 3.3kV full-SiC modules in 2013, and development of ultra-compact SiC-DIPIPM modules in 2016. These new SLIMDIP modules further expand the company’s energy-efficient product lineup, offering manufacturers greater flexibility for appliance design.
The new modules will debut at PCIM Europe 2025 in Nuremberg, and will also be showcased in Japan, China, and other major markets through upcoming industry trade shows.
