Samsung Develops Next-Gen Glass Interposer to Enhance Chip Performance and Reduce Costs
Samsung Electronics is actively developing a next-generation packaging material—glass interposers—aiming to replace costly silicon interposers while simultaneously boosting semiconductor performance, according to recent industry reports.
Samsung Electronics is actively developing a next-generation packaging material—glass interposers—aiming to replace costly silicon interposers while simultaneously boosting semiconductor performance, according to recent industry reports.
Glass Interposer: A Game-Changer in Semiconductor Packaging
The Device Solutions (DS) division of Samsung Electronics has initiated this project in collaboration with Australian materials company Chemtronics and South Korean equipment manufacturer Philoptics. Reports indicate that Samsung may use Corning glass to manufacture the new glass interposer, leveraging its superior thermal and mechanical properties.
Samsung’s Dual Approach: Internal Competition Drives Innovation
In parallel with Samsung Electronics’ efforts, its subsidiary, Samsung Electro-Mechanics, is also developing glass-based substrates (also known as glass carriers), with mass production expected in 2026. This dual-track development strategy fosters internal competition, which Samsung hopes will accelerate technological breakthroughs and cost efficiency in semiconductor manufacturing.
Why Glass Interposers? The Key Benefits
The interposer serves as the connection layer between the semiconductor substrate and the chip. Traditionally, silicon interposers have been used, but they contribute significantly to the high costs of advanced semiconductors. By switching to glass interposers, Samsung aims to:
Reduce production costs significantly compared to silicon
Improve thermal and mechanical stability
Simplify the fabrication process of microelectronic circuits
Strategic Implications for Samsung’s Semiconductor Business
The transition to glass interposers is expected to enhance Samsung’s competitiveness in high-performance computing (HPC), artificial intelligence (AI), and advanced chip packaging. The move also reflects Samsung’s urgent need to innovate across its entire semiconductor supply chain, responding to increasing challenges from competitors in the industry.
