IC Onlineerai

Shifts in the Silicon Carbide Industry: ROHM, Wolfspeed, and Sumitomo Electric Restructure Strategies

The silicon carbide (SiC) industry is undergoing significant transformations as major players, including ROHM Semiconductor, Wolfspeed, and Sumitomo Electric, adjust their strategies in response to evolving market conditions.

The silicon carbide (SiC) industry is undergoing significant transformations as major players, including ROHM Semiconductor, Wolfspeed, and Sumitomo Electric, adjust their strategies in response to evolving market conditions.

ROHM is restructuring leadership and delaying its SiC production capacity expansion due to financial constraints.

Wolfspeed faces revenue decline and is implementing a $450 million facility shutdown and consolidation plan.

Sumitomo Electric has canceled a ¥30 billion ($205 million USD) investment in a new SiC wafer fab due to weak electric vehicle (EV) demand.

ROHM: Leadership Change and SiC Expansion Delay

Japanese semiconductor giant ROHM announced that Katsumi Higashi will replace Isao Matsumoto as CEO starting April 1, 2025. Matsumoto will assume an advisory role. The leadership transition comes amid financial pressures, with ROHM reporting a ¥6 billion ($41 million USD) net loss for the 2024 fiscal year, marking its first full-year loss since 2012.

ROHM’s 2024 H1 revenue declined 3% year-over-year (YoY) to ¥232 billion ($1.7 billion USD). As a result, the company has reduced its SiC investment budget from ¥510 billion to ¥470-480 billion ($3.2 billion USD). The company also cut its 2024 capex to ¥150 billion ($1.05 billion USD) and plans to reduce 2025 capex below ¥100 billion ($700 million USD).

ROHM originally planned to reach ¥110 billion ($770 million USD) in SiC revenue by FY2025, but this milestone has been postponed to 2026-2027 due to slower-than-expected demand in the EV and industrial sectors.

SiC Expansion:

ROHM is transitioning to 8-inch SiC wafers, with its Fukuoka Chikugo fab slated for mass production in 2025.

The Miyazaki 2nd fab is also expected to go live in 2025.

The company initially aimed to increase SiC output to 6.5× 2021 levels by 2025, but this timeline is now extended by a year.

Technology Development:

ROHM is focusing on next-gen SiC MOSFETs and power modules, such as the TRCDRIVE pack™, which integrates 4th-gen SiC MOSFETs, improving power density by 1.5× and simplifying design integration.

Wolfspeed: Financial Struggles, Facility Closures, and Government Support

U.S.-based SiC leader Wolfspeed recently reported a 1.37% YoY revenue decline to $195 million for Q1 FY2025. The company also posted a net loss of $282 million, despite narrowing its deficit by 28.68% YoY.

To mitigate financial losses, Wolfspeed launched a $450 million facility shutdown and consolidation initiative, which includes:

Closing its 150mm SiC wafer fab in Durham, North Carolina.

Selling its Dallas-area SiC epitaxy facility.

Suspending plans for a new fab in Saarland, Germany.

However, Wolfspeed has secured $750 million in direct funding from the U.S. Department of Commerce to support the expansion of its North Carolina and New York fabs.

Sumitomo Electric: Cancels New SiC Wafer Fab Amid EV Demand Slump

Sumitomo Electric has scrapped plans to build a ¥30 billion ($205 million USD) SiC wafer manufacturing plant in Takaoka, Toyama Prefecture due to uncertain EV market recovery.

The company originally planned to mass-produce SiC wafers by 2027, with an annual capacity of 180,000 wafers from its Takaoka and Itami fabs.

With the project now canceled, Sumitomo is likely to refocus on other sectors, such as:

Automotive wiring systems

Power cables for renewable energy infrastructure

Optical components for data centers

Market Shift to 8-inch SiC:

Sumitomo may pivot from 6-inch SiC wafers to 8-inch wafers, following industry trends led by STMicroelectronics, Infineon, and Wolfspeed.

8-inch SiC wafer adoption is still limited, with market share below 2% in 2024, but analysts expect this to rise to 20% by 2027.

Conclusion: SiC Market Faces Challenges and Adjustments

Despite rapid growth in AI data centers, EVs, and industrial applications, the SiC industry is undergoing significant restructuring. ROHM, Wolfspeed, and Sumitomo Electric are making strategic shifts in leadership, production, and investment, with a clear industry transition toward 8-inch SiC wafers.

As demand fluctuates, companies that can optimize costs, secure government incentives, and advance SiC technology will emerge stronger in the long term.

Related Articles

  • EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal DoubtsNews

    EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts

    The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.

  • Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in CaliforniaNews

    Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in California

    May 8, 2025 – California, USA — Cisco Systems has taken a bold step into the future of computing by unveiling a prototype quantum networking chip designed to interconnect quantum computers. At the same time, the company announced the establishment of a brand-new quantum computing research lab in Santa Monica, California, marking a major expansion into the quantum technology landscape.

  • NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10xNews

    NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10x

    May 9, 2025 — U.S.-based memory innovator NEO Semiconductor has announced a major leap in dynamic random-access memory (DRAM) architecture with the launch of its new-generation 3D X-DRAM technology, featuring the industry’s first 1T1C and 3T0C 3D DRAM cell designs. This breakthrough is set to redefine memory performance and scalability for high-demand applications in AI, edge computing, and in-memory processing.

  • TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.News

    TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.

    TSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.

  • Qualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance BoostNews

    Qualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance Boost

    Qualcomm is expected to unveil its next-generation flagship mobile chipset — the Snapdragon 8 Elite Gen 2 — during its Snapdragon Tech Summit, which has been rescheduled earlier this year for September 2025. Ahead of the official launch, key details about the chipset’s architecture and performance enhancements have surfaced, setting the stage for a major leap in mobile computing power.