IC Onlineerai

Silicon Carbide Boom Drives Semiconductor Equipment Expansion

As the silicon carbide (SiC) industry enters a critical development phase in 2025, the shift toward 8-inch wafer production is accelerating. This transformation is fueling increased demand for high-precision semiconductor equipment. Following the successful delivery of 30 sets of SiC epitaxy equipment by CETC (China Electronics Technology Group Corporation), another major development has emerged—Zhongdao Optoelectronics has secured repeat orders from a leading SiC customer for its advanced defect detection systems.

2025: A Pivotal Year for SiC as Industry Transitions to 8-Inch Wafers

As the silicon carbide (SiC) industry enters a critical development phase in 2025, the shift toward 8-inch wafer production is accelerating. This transformation is fueling increased demand for high-precision semiconductor equipment. Following the successful delivery of 30 sets of SiC epitaxy equipment by CETC (China Electronics Technology Group Corporation), another major development has emerged—Zhongdao Optoelectronics has secured repeat orders from a leading SiC customer for its advanced defect detection systems.

Recently, Zhongdao Optoelectronics' NanoPro-150 wafer defect inspection tool received repeat orders from another top-tier SiC manufacturer in China. In January, the same equipment was ordered again by a major domestic semiconductor company.

The company emphasized that it will increase R&D investment in SiC wafer inspection technology by enhancing:

High-precision multi-mode defect detection

AI-driven defect classification algorithms

Overall equipment performance optimization

These advancements aim to significantly improve the quality and yield rates of SiC wafer production.

Challenges in SiC Wafer Inspection

SiC has become a key material in semiconductor applications, offering advantages such as:

  • Wide bandgap
  • High breakdown voltage
  • Superior thermal conductivity
  • High electron saturation velocity

These properties make SiC ideal for high-power, high-frequency applications in sectors such as electric vehicles (EVs), renewable energy, and 5G communications.

However, SiC wafer manufacturing presents significant challenges due to its complex material properties:

  1. Defect Sensitivity: Any micro-level defect can severely impact device performance.
  2. Unique Material Properties: SiC differs from traditional silicon, requiring advanced detection methods.
  3. High-Precision Requirements: Detecting nano-scale defects with high accuracy is extremely challenging.
  4. Multi-Layer Structure Complexity: SiC wafers have layered structures, complicating defect analysis.
  5. Cost Considerations: Given SiC wafers' high production costs, inspection must be both accurate and efficient.

Fierce Competition in the SiC Market

The global SiC industry is becoming increasingly competitive, with major players making strategic investments in wafer production, manufacturing equipment, and semiconductor devices.

Recent SiC Industry Developments

1. Bosch Invests in 8-Inch SiC Production in the U.S.

Bosch has reached an agreement with the U.S. Department of Commerce to invest $1.9 billion in converting its Roseville, California facility into an 8-inch SiC semiconductor plant.

2. Chongqing 8-Inch SiC Project Nears Completion

San’an Optoelectronics and STMicroelectronics' joint venture in Chongqing is expected to begin production by February 2025. The facility will integrate substrate, epitaxy, and chip fabrication for automotive-grade 8-inch SiC wafers.

3. Infineon Expands SiC Capacity in Malaysia

Infineon’s new factory in Kulim, Malaysia, focused on SiC production, is now operational.

Initial production is based on 6-inch wafers, with full transition to 8-inch wafers by 2027.

ChipLink Semiconductor plans to ramp up 8-inch SiC production in 2025.

Nansha Crystal is aiming to become China’s largest 8-inch SiC substrate supplier by reaching full production capacity in 2025.

SiC Industry Outlook: Market Growth and Future Developments

According to TrendForce, SiC's penetration rate in automotive, renewable energy, and high-power applications is accelerating. The SiC power device market is projected to reach $9.17 billion by 2028.

Increasing adoption of SiC in EVs, 5G infrastructure, and aerospace applications.

Growing demand for high-precision SiC inspection and manufacturing equipment.

Continued advancements in SiC crystal growth and wafer quality control.

As SiC demand surges, equipment manufacturers must enhance precision, improve efficiency, and reduce costs. In the crystal growth segment, the focus will be on producing larger, higher-quality SiC wafers while minimizing defects—a key breakthrough area for future industry advancements.

Related Articles

  • UK Launches Europe’s First and the World’s Second Electron Beam Lithography FacilityNews

    UK Launches Europe’s First and the World’s Second Electron Beam Lithography Facility

    May 8, 2025 — In a major technological leap for Europe’s semiconductor industry, the University of Southampton in the United Kingdom has officially launched the continent’s first advanced semiconductor fabrication facility powered by electron beam lithography (EBL). The site now houses the world’s second EBL machine of its kind, marking a key milestone in next-generation chipmaking.

  • TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.News

    TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.

    TSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.

  • EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal DoubtsNews

    EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts

    The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.

  • GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15News

    GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15

    May 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.

  • Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation CapabilitiesNews

    Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities

    Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.

  • Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in CaliforniaNews

    Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in California

    May 8, 2025 – California, USA — Cisco Systems has taken a bold step into the future of computing by unveiling a prototype quantum networking chip designed to interconnect quantum computers. At the same time, the company announced the establishment of a brand-new quantum computing research lab in Santa Monica, California, marking a major expansion into the quantum technology landscape.