IC Onlineerai

SK Hynix Subsidiary Solidigm Launches World's Largest Capacity eSSD for AI - "D5-P5336"

On November 13, SK Hynix's NAND flash solution subsidiary, Solidigm, announced the launch of the world's largest capacity 122TB NAND flash solution based on QLC technology, the enterprise-level solid-state drive (eSSD) "D5-P5336".

On November 13, SK Hynix's NAND flash solution subsidiary, Solidigm, announced the launch of the world's largest capacity 122TB NAND flash solution based on QLC technology, the enterprise-level solid-state drive (eSSD) "D5-P5336".

Solidigm stated, "Our company was the first in the industry to commercialize QLC-based high-capacity SSDs. Since 2018, we have cumulatively supplied over 100EB (exabytes) of products, thereby leading the AI NAND flash solution market. The newly launched D5-P5336 doubles the capacity of the existing 61.44TB product, successfully overcoming technological limitations once again."

The company added, "The 122TB eSSD product is not only the world's largest capacity but also provides industry-leading energy and space efficiency, which is expected to bring greater benefits to global customers building AI infrastructure such as data centers."

The D5-P5336 is the first in the world to offer a five-year random write durability, making it ideal for data-intensive AI workloads. According to Solidigm's technical experts, using this product to build a NAS system can reduce storage space requirements to one-quarter compared to using HDDs and SSDs in hybrid configurations, and power consumption can be reduced by up to 84%.

Additionally, when constructing space-limited edge servers, using this product instead of the commonly used TLC 30TB SSDs allows for four times the storage capacity in the same area, with power density per TB increased by 3.4 times.

Solidigm is currently validating the D5-P5336 with global customers, with production expected to begin early next year. The company plans to continue leading the AI data center NAND flash solution market by offering a wide range of enterprise-level SSD products, from 7TB to 122TB.

Travis Vigil, Senior Vice President of Product Management at Dell Technologies, stated, "As the AI era unfolds, enterprises are deeply considering energy efficiency and spatial efficiency in data centers. Solidigm's enterprise SSDs will maximize these factors, enhancing data center integration."

Greg Matson, Vice President of Strategic Planning and Marketing at Solidigm, added, "As AI applications expand, data center designers are striving to improve energy and spatial efficiency. Our new product will be a game changer in addressing these customer challenges."

Related Articles

  • TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.News

    TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.

    TSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.

  • UK Launches Europe’s First and the World’s Second Electron Beam Lithography FacilityNews

    UK Launches Europe’s First and the World’s Second Electron Beam Lithography Facility

    May 8, 2025 — In a major technological leap for Europe’s semiconductor industry, the University of Southampton in the United Kingdom has officially launched the continent’s first advanced semiconductor fabrication facility powered by electron beam lithography (EBL). The site now houses the world’s second EBL machine of its kind, marking a key milestone in next-generation chipmaking.

  • Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in CaliforniaNews

    Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in California

    May 8, 2025 – California, USA — Cisco Systems has taken a bold step into the future of computing by unveiling a prototype quantum networking chip designed to interconnect quantum computers. At the same time, the company announced the establishment of a brand-new quantum computing research lab in Santa Monica, California, marking a major expansion into the quantum technology landscape.

  • Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation CapabilitiesNews

    Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities

    Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.

  • Samsung’s Harman Acquires Masimo’s Audio Division for $350 Million to Strengthen Automotive Tech FootprintNews

    Samsung’s Harman Acquires Masimo’s Audio Division for $350 Million to Strengthen Automotive Tech Footprint

    May 9, 2025 — Samsung Electronics’ subsidiary Harman International has announced a strategic acquisition of the audio division of U.S.-based Masimo Corporation for $350 million, further cementing its position in the global automotive and consumer electronics markets. The deal marks a significant move in Samsung's ongoing expansion strategy and has sparked speculation around more tech-focused acquisitions in the near future.

  • EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal DoubtsNews

    EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts

    The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.