SK Hynix to Unveil Comprehensive AI Memory Blueprint at CES 2025

On January 3, 2025, SK Hynix announced its participation in CES 2025, the world’s largest consumer electronics exhibition, held in Las Vegas from January 7 to 10. The company aims to demonstrate its cutting-edge AI-driven memory technology, showcasing its role as a "Full-Stack AI Memory Provider."

January 3, 2025

Showcasing Leadership in AI-Driven Memory Solutions
Debuting Advanced HBM and Pioneering AI-Optimized Products
Pledges to Innovate and Drive Value in the AI Era

A Glimpse into SK Hynix’s Vision for AI Memory Solutions

On January 3, 2025, SK Hynix announced its participation in CES 2025, the world’s largest consumer electronics exhibition, held in Las Vegas from January 7 to 10. The company aims to demonstrate its cutting-edge AI-driven memory technology, showcasing its role as a "Full-Stack AI Memory Provider."

The showcase will include key memory products for AI applications, ranging from High Bandwidth Memory (HBM) to Processing-in-Memory (PIM) technologies. Senior executives, including CEO Kwark Roo-Jung, CMO Kim Joo-Seon, and CDO Ahn Hyeon, will present SK Hynix's latest innovations and future roadmap.

Highlights of SK Hynix’s Exhibit

Leading HBM Technologies

SK Hynix, the first company globally to mass-produce 12-layer 5th-generation HBM3E, will display its latest 16-layer 5th-generation HBM3E samples, developed using advanced MR-MUF technology. This innovation achieves unprecedented layer stacking, addressing warp issues and enhancing thermal performance, making it a cornerstone for next-generation AI infrastructure.

High-Performance Enterprise SSDs

With the expanding demand for AI data centers, SK Hynix will showcase enterprise SSDs, including Solidigm's D5-P5336 122TB SSD, the industry’s largest-capacity SSD. This product delivers unparalleled energy efficiency and space optimization, ideal for high-capacity data center environments.

AI-Optimized Edge Products

To address edge AI needs in PCs and smartphones, SK Hynix will feature:

LPCAMM2: A space-saving, high-performance memory module based on LPDDR5X, designed to replace DDR5 SODIMMs.

ZUFS 4.0: Zoned Universal Flash Storage for efficient data management and transfer optimization.

Future-Ready Data Center Solutions

The company will also highlight CXL (Compute Express Link) and PIM (Processing-in-Memory) technologies, along with modular solutions like CMM-Ax and AiMX:

CMM-Ax combines CXL capabilities with computing functionality to enhance server platform performance.

AiMX leverages PIM-based GDDR6-AiM chips to accelerate data processing and improve power efficiency.

Commitment to Innovation and Sustainability

SK Hynix’s CES exhibit will form part of a collaborative SK Group pavilion themed “Innovative AI, Sustainable Tomorrow”, featuring contributions from SK Telecom, SKC, and SK enmove. The pavilion will highlight how SK Group’s AI infrastructure and services are shaping a sustainable future.

Focus on Customization and Next-Gen HBM

SK Hynix plans to launch 6th-generation HBM4 production in the second half of 2025. This tailored HBM product line aims to address diverse customer requirements in the AI-driven market, reinforcing the company’s leadership in memory innovation.

Conclusion

SK Hynix’s presence at CES 2025 underscores its strategic shift to becoming a comprehensive AI memory provider. With advancements in HBM, enterprise SSDs, and AI-specific memory solutions, the company is poised to redefine memory technologies for the AI era, offering transformative value to global markets.

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