IC Onlineerai

STMicroelectronics Signs Long-Term Supply Agreement with Renault Group's Ampere for SiC Power Modules

On December 5th, STMicroelectronics, a global leader in semiconductor manufacturing, announced a significant long-term supply agreement with Ampere, the electric vehicle (EV) manufacturing arm of Renault Group.

On December 5th, STMicroelectronics, a global leader in semiconductor manufacturing, announced a significant long-term supply agreement with Ampere, the electric vehicle (EV) manufacturing arm of Renault Group.

According to the agreement, STMicroelectronics will begin supplying Silicon Carbide (SiC) power modules to Ampere starting in 2026. This agreement is part of a broader collaboration between Renault Group and STMicroelectronics aimed at developing the power control systems (powerbox) for Ampere’s high-efficiency electric vehicle inverters.

SiC power modules are composed of multiple silicon carbide chips, designed to manage and convert the energy stored in the vehicle’s battery, transforming it into the power needed to operate the electric motor. These power modules play a vital role in enhancing the energy efficiency of electric drive systems, extending battery life, and improving energy recovery. Additionally, they contribute to smoother driving experiences and more responsive performance.

The market for SiC power devices has been rapidly expanding in recent years, driven by the surge in demand for new energy vehicles, photovoltaic energy storage, and electric vehicle charging industries. According to the latest TrendForce 2024 Global SiC Power Device Market Report, while the growth rate of battery electric vehicle (BEV) sales has slowed, the demand for SiC remains robust, particularly in high-power density and efficiency applications in industries like automotive and renewable energy. The global SiC power device market is expected to reach $9.17 billion by 2028, indicating continued growth in the coming years.

Related Articles

  • GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15News

    GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15

    May 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.

  • EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal DoubtsNews

    EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts

    The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.

  • TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.News

    TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.

    TSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.

  • UK Launches Europe’s First and the World’s Second Electron Beam Lithography FacilityNews

    UK Launches Europe’s First and the World’s Second Electron Beam Lithography Facility

    May 8, 2025 — In a major technological leap for Europe’s semiconductor industry, the University of Southampton in the United Kingdom has officially launched the continent’s first advanced semiconductor fabrication facility powered by electron beam lithography (EBL). The site now houses the world’s second EBL machine of its kind, marking a key milestone in next-generation chipmaking.

  • Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in CaliforniaNews

    Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in California

    May 8, 2025 – California, USA — Cisco Systems has taken a bold step into the future of computing by unveiling a prototype quantum networking chip designed to interconnect quantum computers. At the same time, the company announced the establishment of a brand-new quantum computing research lab in Santa Monica, California, marking a major expansion into the quantum technology landscape.

  • Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation CapabilitiesNews

    Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities

    Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.