The all-new STM32U0 series MCU has arrived, creating a perfect balance between power consumption, functionality, and cost.
The all-new STM32U0 series MCU has arrived, creating a perfect balance between power consumption, functionality, and cost.
The all-new STM32U0 series MCU has arrived, creating a perfect balance between power consumption, functionality, and cost.
NewsTSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.
NewsMay 13, 2025 — Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) announced that it will showcase a comprehensive suite of 3D AI semiconductor solutions at COMPUTEX Taipei 2025, partnering with key supply chain collaborators including Etron Technology, Winbond, ITRI, Ardentec, Skymizer, Mantex, Zentel, and Powerchip Microelectronics.
NewsQualcomm is expected to unveil its next-generation flagship mobile chipset — the Snapdragon 8 Elite Gen 2 — during its Snapdragon Tech Summit, which has been rescheduled earlier this year for September 2025. Ahead of the official launch, key details about the chipset’s architecture and performance enhancements have surfaced, setting the stage for a major leap in mobile computing power.
NewsThe European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.
NewsMay 9, 2025 — U.S.-based memory innovator NEO Semiconductor has announced a major leap in dynamic random-access memory (DRAM) architecture with the launch of its new-generation 3D X-DRAM technology, featuring the industry’s first 1T1C and 3T0C 3D DRAM cell designs. This breakthrough is set to redefine memory performance and scalability for high-demand applications in AI, edge computing, and in-memory processing.
NewsMay 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.