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Xinyuan System's Global R&D and Testing Base Project Breaks Ground

According to Chengdu High-Tech Zone news, Xinyuan System's global R&D and testing base project recently held a groundbreaking ceremony in Chengdu High-Tech Zone.

According to Chengdu High-Tech Zone news, Xinyuan System's global R&D and testing base project recently held a groundbreaking ceremony in Chengdu High-Tech Zone.

The project covers an area of 32 acres with a building area of 75,000 square meters and is Xinyuan System Co., Ltd.'s fourth phase project in Chengdu High-Tech Zone. The main facilities include an R&D center, testing center, operations center, and marketing center, with construction expected to be completed within two years. Once operational, the project is expected to achieve an annual testing capacity of 20 billion power management chips, making it potentially the largest analog and mixed-signal IC R&D and application center in Asia.

Xinyuan System is headquartered in the United States and primarily engages in the design, R&D, manufacturing, and sales of high-performance analog and mixed-signal power management chips. The company has independently developed over 4,000 products, which are widely used in industrial, communication infrastructure, cloud computing, automotive, and consumer electronics sectors. Chengdu Xinyuan System Co., Ltd. is Xinyuan System's first wholly-owned subsidiary established globally.

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