IC Onlineerai
News

ZEISS Completes Acquisition of Beyond Gravity’s Lithography Division

On December 2, ZEISS announced the successful acquisition of the lithography division of Beyond Gravity, integrating it into its Semiconductor Manufacturing Technology (SMT) division. Effective December 1, 2024, Beyond Gravity’s lithography business has been incorporated into ZEISS SMT, with the Cossweid facility now operating under the name Carl Zeiss SMT Switzerland AG.

On December 2, ZEISS announced the successful acquisition of the lithography division of Beyond Gravity, integrating it into its Semiconductor Manufacturing Technology (SMT) division.

Effective December 1, 2024, Beyond Gravity’s lithography business has been incorporated into ZEISS SMT, with the Cossweid facility now operating under the name Carl Zeiss SMT Switzerland AG.

About Beyond Gravity and ZEISS

Beyond Gravity, headquartered in Zurich, Switzerland, is a key supplier of structural components for various rocket types. It is a leading player in satellite products and constellation technology.

ZEISS is a global leader in optical and optoelectronic technologies, operating across four major domains:

  1. Semiconductor Manufacturing Technology
  2. Industrial Quality & Research
  3. Medical Technology
  4. Consumer Markets

Within its SMT division, ZEISS offers cutting-edge semiconductor manufacturing optics, including lithography optics, photomask systems, and process control solutions. Headquartered in Oberkochen, Germany, ZEISS SMT has additional facilities in Germany, Switzerland, Israel, and the United States.

Strategic Benefits of the Acquisition

The acquisition of Beyond Gravity’s lithography division will significantly enhance ZEISS SMT’s production and research capabilities, bolstering its competitive edge in the semiconductor industry. This move aligns with ZEISS’s strategy to reinforce its leadership in advanced semiconductor manufacturing technologies, particularly in lithography optics—a critical component for producing next-generation semiconductor devices.

With this integration, ZEISS is set to expand its technological footprint and strengthen its role in driving innovation within the semiconductor sector.

← Previous ArticleNext Article >>

Related Articles

  • Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation CapabilitiesNews

    Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities

    Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.

  • TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.News

    TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.

    TSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.

  • NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10xNews

    NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10x

    May 9, 2025 — U.S.-based memory innovator NEO Semiconductor has announced a major leap in dynamic random-access memory (DRAM) architecture with the launch of its new-generation 3D X-DRAM technology, featuring the industry’s first 1T1C and 3T0C 3D DRAM cell designs. This breakthrough is set to redefine memory performance and scalability for high-demand applications in AI, edge computing, and in-memory processing.

  • Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in CaliforniaNews

    Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in California

    May 8, 2025 – California, USA — Cisco Systems has taken a bold step into the future of computing by unveiling a prototype quantum networking chip designed to interconnect quantum computers. At the same time, the company announced the establishment of a brand-new quantum computing research lab in Santa Monica, California, marking a major expansion into the quantum technology landscape.

  • EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal DoubtsNews

    EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts

    The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.

  • Qualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance BoostNews

    Qualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance Boost

    Qualcomm is expected to unveil its next-generation flagship mobile chipset — the Snapdragon 8 Elite Gen 2 — during its Snapdragon Tech Summit, which has been rescheduled earlier this year for September 2025. Ahead of the official launch, key details about the chipset’s architecture and performance enhancements have surfaced, setting the stage for a major leap in mobile computing power.