Adapter, Breakout Boards35 Products
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| Image | Part Number | Manufacturer | Description | Actions | |
|---|---|---|---|---|---|
 PDF | DA-MSOP8-3X3P65 | Artekit Labs | MSOP-8 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-SOT23-6-P95 | Artekit Labs | SOT23-6 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-QFN32-4X4P40 | Artekit Labs | QFN-32 TO DIP ADAPTER 4MM X 4MM | MOQ: 1 Hover to quote | |
 PDF | DA-QFN28-5X5P50 | Artekit Labs | QFN-28 TO DIP ADAPTER 5MM X 5MM | MOQ: 1 Hover to quote | |
 PDF | DA-QFN16-3X3P50 | Artekit Labs | QFN-16 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-SOT23-3-X2 | Artekit Labs | TWO SOT23-3 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-TSSOP28-P65 | Artekit Labs | TSSOP-28 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-TSSOP24-P65 | Artekit Labs | TSSOP-24 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-DFN8-3X3P65 | Artekit Labs | DFN-8 TO DIP ADAPTER 3MM X 3MM | MOQ: 1 Hover to quote | |
 PDF | DA-TO252-P233 | Artekit Labs | TO252 (DPAK 3-4 PINS) ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-QFN36-6X6P50 | Artekit Labs | QFN-36 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-DFN10-3X3P50 | Artekit Labs | DFN-10 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-QFN20-4X4P50 | Artekit Labs | QFN-20 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-QFN28-4X4P40 | Artekit Labs | QFN28 DIP ADAPTER 4MM X 4MM P0.5 | MOQ: 1 Hover to quote | |
 PDF | DA-TSSOP20-P65 | Artekit Labs | TSSOP-20 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-QFN32-6X6P65 | Artekit Labs | QFN-32 TO DIP ADAPTER 6MM X 6MM | MOQ: 1 Hover to quote | |
 PDF | DA-DFN8-3X2P50 | Artekit Labs | DFN-8 TO DIP ADAPTER 3MM X 2MM | MOQ: 1 Hover to quote | |
 PDF | DA-SOT223-3-P230 | Artekit Labs | SOT223-3 TO DIP ADAPTER - P2.30 | MOQ: 1 Hover to quote | |
 PDF | DA-SOIC14-P127 | Artekit Labs | SOIC-14 TO DIP ADAPTER | MOQ: 1 Hover to quote | |
 PDF | DA-DFN14-4X3P50 | Artekit Labs | DFN-14 TO DIP ADAPTER | MOQ: 1 Hover to quote |
Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.