NewsSK Hynix Begins Mass Production of World's Highest 321-Layer NAND Flash Memory
2024-11-21 — SK Hynix has announced the commencement of mass production of the world's highest 321-layer 1Tb (terabit) TLC (Triple Level Cell) 4D NAND flash memory.
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NewsJapan Invests $1.3 Billion in Rapidus to Boost 2nm Chip Production by 2027
The Japanese government is taking significant strides to boost its domestic semiconductor manufacturing industry, committing $1.3 billion (200 billion yen) in funding for chipmaker Rapidus in fiscal 2025. This move is aimed at stimulating further investment and financing from the private sector, with Rapidus aiming to achieve mass production of 2nm chips by 2027.
NewsWolfspeed CEO Gregg Lowe Steps Down Amid EV Market Challenges
On November 18, global silicon carbide leader Wolfspeed announced that CEO Gregg Lowe has been removed from his position due to increasing challenges associated with the slowing demand in the electric vehicle (EV) sector. The announcement led to a roughly 6% rise in the company's stock price. Lowe, who also held the title of President, will step down from all roles, including his position on the board of directors, by the end of the month. To ensure smooth business continuity, current chairman Thomas Werner will temporarily take on the role of Executive Chairman until a suitable replacement for the CEO is appointed.
NewsHuangshan Gujie Completes Registration for ChiNext IPO, Plans to Raise 502 Million Yuan
Huangshan Gujie Co., Ltd. ("Huangshan Gujie") has successfully completed the registration process for its ChiNext initial public offering (IPO) on November 6, as disclosed by the Shenzhen Stock Exchange.
NewsShenzhen SiC Company Completes Shareholding Restructuring and Announces Name Change
On November 15th, according to the official WeChat account of Basic Semiconductor, the company successfully completed its shareholding restructuring and business registration change procedures, formally changing its name to "Shenzhen Basic Semiconductor C
NewsBlackwell AI Chip Overheating Allegations? Dell and Partners Respond
Recent media coverage, notably from The Information, reported that NVIDIA's Blackwell architecture AI chips, designed for AI and high-performance computing (HPC), are facing overheating issues when used in servers equipped with 72 processors. These high-density servers, with power consumption reaching up to 120 kW per rack, allegedly experienced thermal management challenges that led to performance limitations and potential hardware risks. As a result, concerns were raised regarding possible delays in server deployment schedules for data centers.
NewsZhuhai Yiyuan Semiconductor Materials Project Commences with $14 Billion Investment
Recently, the Yiyuan Semiconductor Materials Industry Base Project (hereinafter referred to as the "Yiyuan Semiconductor Project") has officially broken ground in Zhuhai. According to "Zhuhai Jinwan," the total investment for the project is approximately 100 billion yuan ($14 billion). The project is incubated by the business unit of the Essie Group's ecological chain development and is led strategically by Huafa Group, aiming to build a globally competitive semiconductor materials industry base.
NewsNova Technology (HK) Co., LTD Concludes a Successful Showing at Electronica 2024 in Munich
Nova Technology (HK) Co., LTD, in collaboration with IC Online, is pleased to announce the successful conclusion of our participation in Electronica 2024, held in Munich from November 12 to 15, 2024. The event was a fantastic opportunity to connect with industry experts, clients, and partners, showcasing our latest PCBA solutions and electronic components at Hall C5, Booth 531.
NewsSemiconductor Equipment Developer Xiner Technology Commences Phase II Plant Expansion
Recently, Xiner Technology announced the commencement of its Phase II plant expansion at the Emerging Industrial Park. The new facility will cover an area of 2,000 square meters, primarily housing a Class 100 cleanroom. This expansion aims to enhance the development and manufacturing capabilities for high-end equipment, including 12-inch temporary bonding and debonding, permanent bonding, and hybrid bonding machines.
NewsTSMC Approves Nearly $15.5 Billion Allocation for New Fab Construction and Advanced Node Capacity
On November 12, according to an announcement on TSMC's official website, the company has approved an allocation of approximately $15.48 billion. This funding will be primarily used for the construction of new wafer fabs, installation of facility systems, and deployment of advanced node capacity.
NewsIndustry's First 300mm Silicon Carbide Substrate Released
On November 13, domestic silicon carbide substrate manufacturer Tianyue Advanced unveiled the industry's first 300mm (12-inch) silicon carbide substrate at the Semicon Europe 2024 exhibition in Munich, Germany. This marks a significant step forward for Tianyue Advanced into the era of ultra-large silicon carbide substrates.
NewsSK Hynix Subsidiary Solidigm Launches World's Largest Capacity eSSD for AI - "D5-P5336"
On November 13, SK Hynix's NAND flash solution subsidiary, Solidigm, announced the launch of the world's largest capacity 122TB NAND flash solution based on QLC technology, the enterprise-level solid-state drive (eSSD) "D5-P5336".