Electronics Component News, Market Trends & Supply Chain Updates
NewsOn November 3, the completion and commissioning ceremony of Sichuan Fullerde's bellows production project for the semiconductor industry was held in the Economic Development Zone of Neijiang City.
NewsIndia's Tessolve has acquired Dream Chip Technologies (DCT), a leading chip design company based in Hanover, Germany, in a deal valued at INR 4 billion (€42.5 million or $47.4 million). DCT, which employs 72 people, was previously acquired by Chinese company Goodix Technology in 2020.
NewsThe era of artificial intelligence (AI) is driving greater demand for high-performance, high-capacity memory technologies, prompting manufacturers to accelerate the development of next-generation memory solutions.
NewsRecently, the Songshan Lake Materials Laboratory's third-generation semiconductor team, in collaboration with Professor Jincheng Zhang and Professor Xiangdong Li from Academician Yue Hao's group at Xidian University, and Guangdong Zhien Technology Co., Ltd., successfully developed high-performance GaN HEMTs wafers based on 2-6 inch AlN single crystal composite substrates.
NewsApple is reportedly advancing the development of its next-generation M5 chip, anticipated to be produced using TSMC's 3nm process and potentially adopting TSMC's SoIC (System-on-Integrated-Chips) advanced packaging technology. This integration could enhance performance and efficiency, with the M5 chip expected to debut in late 2025.
NewsGlobal semiconductor manufacturer ROHM (headquartered in Kyoto, Japan) will participate in the world-leading trade show for electronic components, systems, applications, and solutions—electronica 2024—which will be held from November 12 to 15 in Munich, Germany. ROHM's booth will be located at C3-520, where it will showcase its advanced power and analog technologies aimed at improving power density, efficiency, and reliability in automotive and industrial applications. These technologies are crucial for meeting the growing demands of modern electronic systems, particularly in the context of sustainability and innovation.
NewsHefei University of Technology Achieves Breakthrough in Integrated Circuit Reliability with 6T SRAM Self-Heating Effect Characterization
NewsWafer Foundry Giants Make Moves That Shake Up the Industry Landscape
NewsFoxconn's packaging subsidiary, Foxsem, is set to invest $80 million to increase its chip manufacturing capacity in Vietnam. Foxsem will contribute $20 million, with the remaining $60 million to be financed through loans, to expand its production capabilities at the Bắc Giang facility.
NewsTaiwan Semiconductor Manufacturing Company (TSMC), the world's largest semiconductor manufacturer, is set to receive ASML's most advanced High NA Extreme Ultraviolet (EUV) lithography machines before the end of the year, according to Nikkei Asia. These cutting-edge machines, priced at over $350 million each, enable semiconductor manufacturers to produce chips with smaller transistor linewidths.
NewsIntel is currently looking to sell a minority stake in its Programmable Solutions Group, Altera, with potential buyers such as Silver Lake and Bain Capital preparing to make a move, according to a Reuters report. Altera, a market leader in the FPGA space and the inventor of the world's first programmable logic device, was acquired by Intel for nearly $17 billion in 2015 with the expectation that it would help expand Intel's presence in the Internet of Things market.
NewsOn October 30, it was reported by the American Herald that New York-based silicon carbide material manufacturer Pallidus has terminated its relocation and new plant construction plans.