Form
Jar
Type
Solder Sphere
Series
CHIPQUIK®
Process
Lead Free
RoHS Compliant
Why Choose Us
Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
Fast RFQ
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MOQ1 pcs
Professional Packaging
Original Packaging
Factory sealed, ESD anti-static tray
Desiccant Protection
Humidity indicator card & silica gel included
Vacuum Sealing
Moisture barrier bag, nitrogen filled
Secure Boxing
Anti-vibration foam, shock-proof labeling
| Parameter | Value |
|---|---|
| Category | Solder |
| Manufacturer | Chip Quik Inc. |
| Form | Jar |
| Type | Solder Sphere |
| Series | CHIPQUIK® |
| Weight | - |
| Process | Lead Free |
| Diameter | 0.020" (0.51mm) |
| Flux Type | - |
| Packaging | Bulk |
| Shelf Life | 24 Months |
| Wire Gauge | - |
| Composition | Sn95.5Ag4Cu0.5 (95.5/4/0.5) |
| Part Status | Active |
| Manufacturer | Chip Quik Inc. |
| Melting Point | 423°F (217°C) |
| Shipping Info | - |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | - |
Package
-
MSL
-