Form
Spool, 4 oz (113.40g)
Type
Wire Solder
Process
Lead Free
Diameter
0.020" (0.51mm)
RoHS Compliant
Why Choose Us
Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
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MOQ1 pcs
Professional Packaging
Original Packaging
Factory sealed, ESD anti-static tray
Desiccant Protection
Humidity indicator card & silica gel included
Vacuum Sealing
Moisture barrier bag, nitrogen filled
Secure Boxing
Anti-vibration foam, shock-proof labeling
| Parameter | Value |
|---|---|
| Category | Solder |
| Manufacturer | Chip Quik Inc. |
| Form | Spool, 4 oz (113.40g) |
| Type | Wire Solder |
| Series | - |
| Process | Lead Free |
| Diameter | 0.020" (0.51mm) |
| Flux Type | Rosin Activated (RA) |
| Packaging | Bulk |
| Shelf Life | - |
| Wire Gauge | 24 AWG, 25 SWG |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Part Status | Active |
| Manufacturer | Chip Quik Inc. |
| Melting Point | 422 ~ 428°F (217 ~ 220°C) |
| Base Product Number | RASW |
Package
-
MSL
-