Form
Jar, 1.76 oz (50g)
Type
Solder Paste
Weight
0.113 lb (51.26 g)
Process
Lead Free
RoHS Compliant
Why Choose Us
Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
Fast RFQ
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MOQ1 pcs
Professional Packaging
Original Packaging
Factory sealed, ESD anti-static tray
Desiccant Protection
Humidity indicator card & silica gel included
Vacuum Sealing
Moisture barrier bag, nitrogen filled
Secure Boxing
Anti-vibration foam, shock-proof labeling
| Parameter | Value |
|---|---|
| Category | Solder |
| Manufacturer | Chip Quik Inc. |
| Form | Jar, 1.76 oz (50g) |
| Type | Solder Paste |
| Series | - |
| Weight | 0.113 lb (51.26 g) |
| Process | Lead Free |
| Diameter | - |
| Flux Type | No-Clean |
| Mesh Type | 3 |
| Packaging | Bulk |
| Shelf Life | 6 Months |
| Wire Gauge | - |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Part Status | Active |
| Manufacturer | Chip Quik Inc. |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Digi-Key Storage | Refrigerated |
| Shelf Life Start | Date of Manufacture |
| Base Product Number | SMD291 |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
Package
-
MSL
-