Frenzied Demand for GPUs Continues as Manufacturers Race to Capture HBM3e Market Opportunities
With the ongoing surge in AI technology, demand for AI chips remains strong. Recently, HBM (High Bandwidth Memory) was reported to be sold out, prompting manufacturers to ramp up production to meet demand. Now, it seems NVIDIA's Blackwell architecture GPUs are also facing unprecedented demand.
With the ongoing surge in AI technology, demand for AI chips remains strong. Recently, HBM (High Bandwidth Memory) was reported to be sold out, prompting manufacturers to ramp up production to meet demand. Now, it seems NVIDIA's Blackwell architecture GPUs are also facing unprecedented demand.
NVIDIA: Blackwell GPUs Sold Out for the Next 12 Months
Despite the Blackwell architecture GPUs being delayed until Q4 of this year, NVIDIA’s order books remain full. According to a report from Tom's Hardware, Morgan Stanley recently hosted a three-day meeting in New York with NVIDIA's CEO Jensen Huang, CFO Colette Kress, and other executives.
Morgan Stanley disclosed that NVIDIA’s Blackwell architecture GPU orders are already sold out for the next 12 months. New customers placing orders now will have to wait until late 2025 for product delivery. Major clients such as AWS, CoreWeave, Google, Meta, Microsoft, and Oracle have pre-purchased the entire production from NVIDIA and its manufacturing partner, TSMC, for upcoming quarters.
The demand for high-performance GPUs and AI chips remains intense, and competition between AI chip manufacturers such as NVIDIA, AMD, and Intel is expected to intensify.
Manufacturers Race to Capture HBM3e Market, Highlighting 12-Hi Products’ Importance
As high-performance AI chips continue to evolve, the need for larger HBM configurations is growing. With each new GPU generation from NVIDIA, AMD, and others, HBM specifications are advancing, shifting from HBM3 to the next-generation HBM3e, creating a lucrative market for manufacturers.
According to TrendForce, global demand for HBM is projected to grow at a rate close to 200% in 2024, with demand set to double again in 2025. They forecast that over 80% of HBM demand in 2025 will be for HBM3e products, with 12-Hi stacks comprising more than half of this demand, making them a major area of competition for AI industry leaders next year, followed by 8-Hi stacks.
Samsung, SK Hynix, and Micron have already submitted their first samples of 12-Hi HBM3e in early 2024 and Q3, respectively. These products are currently undergoing validation, with SK Hynix and Micron expected to complete the process by the end of the year.
