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NewsIn a bold move to strengthen its position in the global AI race, the European Commission has unveiled the “AI Factories Action Plan”, a €20 billion (approx. $21.7 billion) initiative aimed at transforming Europe into a powerhouse of artificial intelligence innovation and infrastructure.
NewsIn a landmark move for Europe’s semiconductor sector, German memory specialist Neumonda has announced a strategic partnership with FMC (Ferroelectric Memory Company) to launch a new non-volatile memory production line in Dresden. This initiative marks Germany’s first attempt to restart domestic DRAM manufacturing since the collapse of Qimonda in 2009.
NewsOn April 10, STMicroelectronics (ST) unveiled a sweeping restructuring initiative targeting its global manufacturing infrastructure, with a focus on next-generation semiconductor technology. This strategic realignment affects eight wafer fabs worldwide, aiming to reinforce ST's leadership in wide bandgap semiconductors such as silicon carbide (SiC). At the same time, competitor onsemi faces market headwinds and is accelerating its transition to a Fab-lite model in response.
NewsAt the 2025 Cloud Next conference, Google unveiled its most powerful AI chip to date — the seventh-generation TPU, codenamed Ironwood. Designed for advanced inference and generative workloads, Ironwood marks a significant leap forward in performance and efficiency, redefining what’s possible for cloud-based artificial intelligence.
NewsThe global semiconductor foundry industry is undergoing a major transition. Amid rising geopolitical complexities and a mixed outlook in downstream demand, the sector is witnessing leadership reshuffles, consolidation rumors, and intensified competition in advanced manufacturing technologies. The race toward 2nm chip production is heating up, signaling the dawn of a new era in semiconductor technology.
NewsBelgium-based GaN (gallium nitride) semiconductor manufacturer BelGaN is reportedly the target of a major acquisition, with a new and unidentified European investor expected to make a bid worth €200 million to €250 million. The prospective buyer is also planning to pivot part of the company’s operations toward silicon photonics chip production, aiming to tap into the fast-growing demand for optical communication solutions in data centers and AI infrastructure.
NewsA team of scientists from Columbia University, Cornell University, and partner institutions in the United States has successfully developed a revolutionary 3D photonic-electronic chip that merges cutting-edge photonics with advanced CMOS (complementary metal-oxide-semiconductor) technology. The innovation marks a significant leap toward more efficient data communication and processing in next-generation AI systems.
NewsOn April 7, German semiconductor giant Infineon Technologies announced it will acquire the automotive Ethernet business of Marvell Technology in an all-cash deal worth $2.5 billion. The acquisition is expected to close in 2025, pending regulatory approvals and customary closing conditions.
NewsSamsung Electronics is planning to increase prices for its DRAM and NAND flash memory products by 3% to 5%, according to a recent report from Korean media outlet Pulse. This move comes as the global memory market begins showing signs of recovery, following a prolonged period of oversupply and weak demand.
NewsIn a move to significantly improve power conversion efficiency in AI data centers, YuanBrain Servers has officially announced the full integration of Gallium Nitride (GaN) Titanium-grade power supplies, offering multiple options at 1300W, 1600W, and 2000W.
NewsApril 4, 2025 – Taipei – Renowned performance memory and gaming hardware brand G.SKILL has officially launched the world’s first DDR5-8000 CL44 128GB (64GBx2) ultra-capacity overclocking memory kit. This groundbreaking release marks the first time a single 64GB DDR5 module has reached the DDR5-8000 speed tier, setting a new milestone in the world of high-performance memory.
NewsOn April 2, advanced ASIC design services provider Global Unichip Corp (GUC) announced a major industry milestone: the successful tape-out of its HBM4 controller and PHY IP, built on TSMC’s most advanced N3P process and integrated using CoWoS®-R advanced packaging.